| 系统 | 处理器 | 6th/7th Generation Intel® Core™Processors LGA 1151 socket for |
芯片组 | Intel®H110 Chipset Intel®Q170 Chipset | |
| 内存 | Two 260-pin DIMM up to 32GB Dual Channel DDR4 1866/2133MHz | |
BIOS | Insyde SPI 128Mbit | |
| 图形 | 控制器 | Intel® HD Gen 9 Graphic |
| 显示 | 1 x HDMI 1 x VGA 1xDP | |
| 存储 | 内部 | 1 x 2.5" SATA 3.0 Drive Bay |
| 扩张 | 接口 | 1 x Half-size Mini PCIe socket (PCIe/USB 2.0) 1 x M.2 M Key 2280 (Support SATA signal only) |
| 以太网 | 指示器 | 1 x Power LED 1 x Storage LED |
| FRONT I/O | USB | 2 x USB 2.0 4 x USB 3.0 |
| 按钮 | 2 x USB 2.0 4 x USB 3.0 | |
| Wi-Fi 天线 | 2 x Antenna Hole | |
| REAR I/O | 以太网 | 2 x GbE (RJ-45) |
| 显示 | 2 x HDMI | |
| 音频 | 1 x Line-out 1 x Mic-in | |
| 电力 | 类型 | 12V DC in |
| 连接器 | DC Jack | |
| 操作系统支持 | Windows 10 IoT Enterprise LTSB 64 Bit | |
| 机构 | 材质 | SGCC + Aluminum |
| 支座 | Wall | |
| 尺寸(W x H x D) | 235mm x 221.5mm x83mm(WxDxH) | |
| 重量 | < 1Kg | |
| 环境 | 工作温度 | -20 to 40°C |
| 储存温度 | -20 to 85°C | |
| 相对湿度 | 5 to 95% RH (non-condensing) | |
| 标准和认证 | 冲击 | Half sine wave 3G, 11ms, 3 shock per axis |
| 振动 | IEC68-2-64 | |
| 认证 | CE, FCC Class A, RoHS, UL/cUL |
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